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研究了时效温度和时效时间对Cu-Ni-Si-P合金组织和性能的影响。结果表明:合金先经900℃固溶,再经不同冷变形后时效,当变形量为80%、时效温度达到450℃、时效2 h后,其显微硬度达到220 HV,导电率达到41%IACS,与未经预冷变形的合金时效相比,合金能获得较高的显微硬度与导电率。Cu-Ni-Si-P合金在较短时间时效时,析出相细小弥散分布。利用高分辨技术观察该合金在450℃时效48 h的析出相形貌,通过计算发现:析出相与基体之间保持着良好的共格关系,并通过对其进行标定,发现析出相为Ni2Si和Ni3P。
The effects of aging temperature and aging time on microstructure and properties of Cu-Ni-Si-P alloy were studied. The results show that when the alloy is first solutionized at 900 ℃ and aged by different cold deformation, the microhardness reaches 220 HV and the electrical conductivity reaches 41% when the deformation is 80%, the aging temperature reaches 450 ℃ and the aging time is 2 h. IACS, compared with the alloy without pre-aging deformation, the alloy can obtain higher microhardness and electrical conductivity. Cu-Ni-Si-P alloy aging in a short time, the precipitated phase fine dispersion. The morphology of the precipitated phase of the alloy after aging at 450 ℃ for 48 h was observed by high-resolution technique. It was found by calculation that there was a good coherent relationship between the precipitated phase and the matrix and that the precipitated phase was Ni2Si and Ni3P.