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建筑物内总等电位联结是防止电击事故的一项重要安全措施,它可大幅度地降低在接地故障情况下人体所遭受的接触电压,比重复接地降低接触电压的幅度大得多。这样,即使在接地故障保护失灵的情况下,它也能在一定程度上减轻电击伤亡危险。另外,对于TN系统来说,总等电位联结还可消除从建筑物外部窜入危险电压的危害,也为防范雷害和保证电子信息设备正常工作所必需。
The total equipotential bonding in a building is an important safety measure against electric shock. It greatly reduces the contact voltage experienced by the human body in the event of a ground fault and is much larger than the contact voltage reduced by repeated contacts. In this way, it mitigates the risk of electric shock injuries to a certain extent even if the ground fault protection fails. In addition, for TN systems, the total equipotential bonding also eliminates the risk of dangerous voltage escaping from outside the building and is also necessary to prevent lightning damage and ensure the proper functioning of electronic information equipment.