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传统的光刻生产工艺 ,有不可克服的光学极限。压印光刻法为集成电路的生产提供了一种快速、经济的方案。采用电子束直写、步进制模、压印翻制的压印模具生产工艺 ,其模具的制造是目前面临的难点。为了获得高质量的压印模具 ,着重从固化剂的添加量、固化温度及时间等方面进行分析和研究。通过考查压印模具的平整度、均一性、特征尺寸及模具表面的固化收缩率等的变化 ,得到了压印模具制作的最佳工艺组合。
The traditional photolithography production process, there are insurmountable optical limit. Imprint lithography provides a fast and economical solution for the production of integrated circuits. The use of electron beam direct write, step molding, embossing stamping mold production process, the mold manufacturing is the current difficulties. In order to obtain high-quality imprinting molds, emphasis is put on analysis and research on the amount of curing agent, curing temperature and time. By examining the flatness of the imprinting mold, the uniformity, the characteristic size and the curing shrinkage rate of the mold surface, the optimal process combination of the imprinting mold was obtained.