本文提出了一种改进的PEEC模型 ,为便于在大规模互连封装结构分析中利用规模缩减技术 ,它以描述系统的状态方程代替了具体的等效电路 .为此它以矢量磁位的积分表达式和洛仑兹规范代替了矢量磁位和标量电位的积分表达式 ,对积分方程进行展开 .这样做可以避免复杂介质结构中的电容矩阵提取 ,大大节省了计算时间 .这一模型可方便地嵌入更大的系统进行分层次的综合分析和利用PVL等规模缩减技术 .数值计算的结果与其他文献吻合较好 ,表明该方法有较高的可靠性 This paper presents an improved PEEC model, in order to facilitate the use of scale-down techniques in the analysis of large-scale interconnect packaging structure, which describes the system state equation instead of a specific equivalent circuit for which it is the vector magnetic bit integral The expression and Lorentz standard replace the integral expressions of vector magnetic and scalar potentials and expand the integral equation, which can avoid the extraction of capacitance matrix in complex medium structure and save the calculation time greatly. This model is convenient Embedded in a larger system for hierarchical and comprehensive analysis and the use of PVL and other scale-reduction techniques.The numerical results agree well with other documents, indicating that the method has high reliability