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进行了Ni+( 1 3 0keV)、Ti( 1 50keV)离子注入Al2 O3(质量分数为 85% ) -ZrO2 (质量分数为 1 5% )陶瓷表面改性试验 ,对改性陶瓷材料表面进行了X -光衍射谱物相分析、表面导电性分析以及与不锈钢材料的非活性钎焊性能分析。结果表明 ,注Ni+和注Ti+陶瓷表层导电性未发现明显变化 ,而注Ti+的陶瓷表层材料在注入剂量达到3× 1 0 17ions/cm2 时其导电性有明显的提高 ,这是由于在陶瓷材料表层生成的钛氧化物的导电性较高的原故。离子注入确实可以显著提高陶瓷材料的可焊性 ,但提高陶瓷材料表面导电性并不是提高其钎焊性能的主要因素。
The surface modification experiments of Ni + (1 300 keV) and Ti (150 keV) ion implanted Al 2 O 3 (mass fraction 85%) -ZrO 2 (mass fraction 1 5%) were carried out. The surface of the modified ceramic material was subjected to X - Light Diffraction Spectral Phase Analysis, Surface Conductivity Analysis and Inactive Brazing Properties Analysis with Stainless Steel Materials. The results show that there is no obvious change in the surface conductivity of Ni + and Ti +. However, the electrical conductivity of Ti + doped ceramic surface layer obviously increases when the implantation dose reaches 3 × 10 17 ions / cm 2, The surface layer of titanium oxide is highly conductive. Ion implantation can significantly improve the solderability of ceramic materials, but increasing the surface conductivity of ceramic materials is not the main factor to improve its brazing performance.