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研究不同参数退火处理的熔石英表面损伤修复点再次损伤及损伤增长时的形貌和损伤增长率的差异,同时与未退火的基底及修复点的损伤增长行为对比.结果表明:未退火的修复点再次损伤后,损伤点周围的裂纹会在应力的作用下继续扩展,导致更加严重、尺寸更大的损伤点;当退火处理将修复点周围应力导致的光程差控制在25 nm左右时,虽损伤增长速率较快,但可有效抑制裂纹扩展.同时研究结果也表明只要退火过程能将修复点周围应力导致的光程差控制在10 nm以下,其损伤增长率与基底的损伤增长率没有明显差异,从而可以有效控制修复点的损伤增长速率.研究结果可为分析应力对修复点损伤增长的影响、指导退火参数的优化提供参考.
The differences of morphological and damage growth rate of fused-silica surface damage repair points with different parameters annealed and damage growth were compared with those of un-annealed substrate and repair points.The results showed that the un-annealed repair After the point of re-damage, the crack around the damage point will continue to expand under the stress, resulting in a more serious and larger damage point. When the annealing process causes the optical path difference caused by the stress around the repair point to be controlled at about 25 nm, Although the damage growth rate is faster, but the crack growth can be effectively suppressed.At the same time, the results also show that as long as the annealing process can control the optical path length difference around the repair point below 10 nm, the damage growth rate and damage growth rate of the substrate is not Which can effectively control the damage growth rate of the repaired point.The results of the study can provide references for the analysis of the influence of stress on the growth of repaired point damage and the optimization of annealing parameters.