对采用半固态搅拌法制备的ＳｉＣＰ／ＺＡ２２复合材料的组织和常温、高温力学性能进行了研究，并和ＺＡ２２基体合金作了对比．研究发现：ＳｉＣ颗粒大多分布于晶界，部分ＳｉＣ颗粒和基体界面上有反应物生成，ＳｉＣ可以充当合金初生相形核衬底，分布于晶内并细化枝晶。力学性能与颗粒分布均匀性、界面结合强度密切相关。和ＺＡ２２合金相比，该复合材料弹性模量上升，冲击韧性下降，高温条件下表现出较好的力学稳定性 The microstructure and mechanical properties at room temperature and high temperature of SiCP / ZA22 composite prepared by semi-solid stirring method were studied and compared with that of ZA22 matrix alloy. It is found that SiC particles are mostly distributed in the grain boundaries, and some reactants are formed at the interfaces between some SiC particles and the matrix. SiC can act as the primary nucleation substrate of the alloy and distribute in the grains and refine the dendrites. Mechanical properties and particle distribution uniformity, interface bonding strength is closely related. Compared with the ZA22 alloy, the elastic modulus of the composite material increases, the impact toughness decreases, and the composite material exhibits better mechanical stability under high temperature conditions