依照惯例,集成电路器件中的最小线宽每隔六年缩小一倍,由实验技术转变为常规生产工艺一般需要十年。下一个十年看来也不会违背这个规律,目前的圆片产品最小线宽大约为1微米,每个芯片上的几何图形数也有相应的增长。正在投入生产的1兆比特数据随机存取器在最复杂的膜层上,每个芯片有几百万个图形。4兆比特的随机存取器也即将生产出来。印刷这些图形不仅要求准确,而且必须快速。 Traditionally, the minimum line width in integrated circuit devices has been reduced by six-fold every six years and it generally takes ten years from experimental technology to conventional production processes. The next decade does not seem to violate this law, the current minimum width of wafer products is about 1 micron, the number of geometries on each chip has a corresponding increase. The 1-Mbit data random accessors in production are on the most complex layers, with millions of graphics per chip. A 4 Mbit random access memory is also coming soon. Printing these graphics is not only accurate, but it must be fast.