本文介绍了近年来CYG压力传感器在批量生产工艺上的主要改进措施:二氧化硅悬浮液抛光,TCE预处理及应力退火技术。并简要叙述了采取上述措施及选择具体工艺条件的思路。这些措施采取的结果是:敏感芯片的合格率大幅度提高,成品的高档比例显著增大,低压力量程品种的零位稳定性和成品率显著改善和提高。 This paper introduces the main improvement measures of CYG pressure sensor in mass production in recent years: silicon dioxide suspension polishing, TCE pretreatment and stress annealing. And briefly describes the idea of ​​adopting the above measures and selecting specific technological conditions. The results of these measures are as follows: the pass rate of sensitive chips is greatly increased, the proportion of high grade products is significantly increased, and the zero stability and yield of low pressure range varieties are significantly improved and improved.