采用双晶摆动曲线法测量了钽酸锂晶片的加工损伤层 ,其平均值在 2 6 .2～ 5 2 .8μm之间 ;根据工序要求 ,选取加工余量为 15 0 μm左右 ,采用天然石榴石研磨粉 ,适当的磨料浓度、添加悬浮剂、分散剂以避免产生缺陷 ,并采用化学机械抛光法 ,可获得较高加工质量的声表面波器件用Y36°切LiTaO3 晶片 The processing damage layer of lithium tantalate wafer was measured by double-crystal swing curve method with the average value between 26.2 and 52.8 μm. According to the process requirements, the machining allowance was selected to be about 150 μm. The natural pomegranate Stone grinding powder, the appropriate abrasive concentration, the addition of suspending agents, dispersants to avoid defects, and the use of chemical mechanical polishing, get higher processing quality SAW devices Y36 ° cut LiTaO3 chip