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探针是在集成电路制造工艺中为了测量芯片的晶体管和集成电路电特性与测试仪相连接而应用的装置,按其使用工艺分如下两种:其一是在芯片工艺流程中为判定芯片或芯片组(用10—20枚芯片组成)的好坏,对于几个监控晶体管和监控集成电路的特性进行取样检验时所应用的手动探针;另一个是从已完成芯片工艺的芯片中筛选出合格管芯送给装架工艺时应用的自动探针;它与自动测试仪连动,依次测量芯片上的集成电路电特性,并标记出好与坏。前者,因其测量端子少,同时也没有精度、输送速度等问题,所以可以自制。因此只以下面注解为例进行说明,后面对于自动探针为适应中规模、大规模集成电路化,主要针对20个针头以上的多头探针以及最近开始使用的固定探针等进行说明。
Probes in the integrated circuit manufacturing process in order to measure the chip transistor and integrated circuit electrical properties and tester connected to the application device, according to the use of technology is divided into the following two: one is in the chip process to determine the chip or Chip set (with 10-20 chip components) is good or bad, for a few monitoring transistors and monitoring IC characteristics of the sampling probe used in the manual probe; the other is from the chip has been completed chip technology out Qualified die is sent to the automatic probe used in the rack process; it is linked with the automatic tester, followed by measuring the electrical properties of the integrated circuits on the chip, and mark the good and bad. The former, because of its measurement terminals less, but also no accuracy, delivery speed and other issues, so you can make. Therefore, the following explanation will be given by way of example only. The automatic probes will be adapted to medium-scale, large-scale integrated circuits, and will be described later mainly with multi-tip probes of 20 or more needles and fixed probes that have recently been used.