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目前,焊接设备外围技术及设备系统的变化很大,例如,在印刷电路板上片状安装元件及混合集成电路的增加,元件的高密度安装,表面安装技术的发展以及工厂的自动化趋向等,这些变化促进了焊接设备及技术的飞速革新。印刷板(PCB)焊接设备正分化发展成接触式流动焊接系统以及非接触式再流焊接系统。本文将讨论这些焊接方法、焊接设备与技术的目前状态及将来发展。在消费类产品的印刷电路板上,并排装有分立元件和片状元件,其中片状元件的占有率和它们的装配密度正在逐年增加。而在工业设备的印刷电路板上,对于集成电路和大规模集成电路的安装,正日益广泛地采用表面安装技术。
At present, peripheral equipment and equipment systems of welding equipment vary greatly, for example, the increase of chip mounting components and hybrid integrated circuits on printed circuit boards, the high density mounting of components, the development of surface mounting technologies, and the automation of factories. These changes have promoted the rapid innovation of welding equipment and technology. Printed board (PCB) welding equipment is being developed into a contact flow welding system and a non-contact reflow soldering system. This article will discuss the current state and future development of these welding methods, welding equipment and technologies. Printed circuit boards for consumer products are equipped with discrete components and chip components side by side, with the share of chip components and their assembly density increasing year by year. On the printed circuit board of industrial equipment, the surface mount technology is being increasingly used for the mounting of integrated circuits and large-scale integrated circuits.