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本文运用断裂力学法分析塑料焊球阵列封装(PBCA)的爆玉米花现象,专门对封装粘片中发生的裂纹,粘片中的裂纹增大以及焊料掩模和铜之间界面处裂纹增大进行研讨,通过两种方法(裂纹尖端开度位移法和有效裂纹闭合技术)确定裂纹尖端参数,诸如应变能释放率,应力强度系数及不同裂纹长度的相角。
In this paper, the crack popcorn method is used to analyze the popcorn phenomenon in plastic solder ball array package (PBCA). The crack crack in the adhesive sheet, the crack in the adhesive sheet and the crack at the interface between the solder mask and copper are increased , The crack tip parameters such as the strain energy release rate, the stress intensity coefficient and the phase angles of different crack lengths were determined by two methods (crack tip opening displacement method and effective crack closure technique).