前言 目前的LSI是在二维平面内制作的,由于微细加工技术的进展,大大地促进了高密度、高集成度、高速化大规模集成电路的进一步发展,可以预言,也许将来总有一天会达到各种技术的极限。因此,作为跨越二维大规模集成电路的极限,对在立体垂直方向上集成电路的三维LSI进行了考虑。 Preface The current LSI is produced in a two-dimensional plane. Due to the progress of the microfabrication technology, the further development of high-density, highly integrated and high-speed large-scale integrated circuits has been greatly promoted. It is predicted that there may be some day in the future Achieve the limits of various technologies. Therefore, in order to overcome the limitation of two-dimensional large-scale integrated circuits, three-dimensional LSIs that integrate circuits in a stereoscopic vertical direction have been considered.