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采用焊点阵列数学分析的方法得到阵列在热循环载荷作用下，由于元件、焊点及基板的热膨胀系数不匹配所产生的阵列对关键焊点的热位移影响。然后利用焊点成形软件得到焊点的形态，通过编制相关转换程序进行关键焊点的非线性有限元分析，从而得到关键焊点体内的最大应变值，利用低周热疲劳寿命预测公式得到焊点的热疲劳寿命。
The effect of the array on the thermal displacement of the key solder joint due to mismatched thermal expansion coefficients of the components, solder joints and the substrate under the effect of thermal cycling load is obtained by using the mathematical analysis of the solder joint array. Then the shape of the solder joint is obtained by using the solder joint forming software. The nonlinear finite element analysis of the key solder joint is made through the preparation of the relevant conversion program so as to obtain the maximum strain value in the critical solder joint body. The low-thermal fatigue life prediction formula is used to obtain the solder joint Thermal fatigue life.