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研究了连接过程中通过原位形成金属间化合物来提高 Ｓｉ_３Ｎ_４陶瓷接头高温性能的可能性、研究了用 Ｔｉ／Ｎｉ／Ｔｉ多层中间层在 １０００—１１５０℃ｔ温度范围内以过渡液相连接 Ｓｉ_３Ｎ_４陶瓷时 Ｔｉ和 Ｎｉ层厚度、连接时施加的压力以及连接温度与保温时间等因素对接头组织和强度（包括室温和高温强度）的影响规律．结果表明，在合理控制连接工艺和中间层金属厚度的条件下，可以通过原位形成金属间化合物获得室温和高温强度均较好的接头，８００ ℃时接头的剪切强度可保持 ８８ ＭＰａ左右
The possibility of improving the high temperature performance of Si_3N_4 ceramic joint by intermetallic compound formation was studied in this paper. The effect of Si_3N_4 interfacial transition of Si_3N_4 on Ti / Ni / Ti interlayer was investigated in the temperature range of 1000-1150 ℃ t The thickness of Ti and Ni layers, the pressure applied during connection, the influence of connection temperature and holding time on the microstructure and strength (including room temperature and high temperature strength). The results show that under the conditions of reasonable control of the connection process and the thickness of the intermediate layer, the intermetallic compounds can be obtained in situ to obtain the joints with good room temperature and high temperature strength. The shear strength of the joint at 800 ℃ can be maintained at about 88 MPa