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研究了BGA焊点在受到热循环冲击与跌落冲击综合作用下的可靠性,研究了基于不同热循环冲击条件下的电子产品的板级跌落寿命、失效机理与失效模式、断裂行为与Kirkendall空洞的关系。结果表明,有铅焊点比无铅焊点可靠性略高,弹性模量低的BGA与PCB制造材料耐热不耐跌落冲击,并提出了改善电子产品可靠性的办法。
The reliability of BGA soldered joints subjected to thermal cycling and drop impact was studied. The board-level drop life, failure mechanism and failure modes of electronic products under different thermal cycling shocks were investigated. The fracture behavior of the BGA soldered joints was compared with that of Kirkendall voids relationship. The results show that lead solder joints are slightly more reliable than lead - free solder joints, and BGA and PCB materials with low modulus of elasticity are resistant to thermal shock and drop impact, and some measures to improve the reliability of electronic products are put forward.