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[会议论文] 作者:Chih-Ang Chung,C.D.Chen, 来源:13th International Biotechnology Symposium and Exhibition(第1 年份:2008
[会议论文] 作者:C.H.Liu,C.S.Wu,Y.W.Su,H.Y.Lin,C.D.Chen, 来源:2015台湾物理年会 年份:2015
  In this study,we propose and demonstrate electroplating of Cu on graphene seed layer.Graphene will be not only as the seed layer but also be the diffusion b...
[会议论文] 作者:C.S.Wu,C.H.Liu,Y.W.Su,H.Y.Lin,C.D.Chen, 来源:2015台湾物理年会 年份:2015
  In this study,we propose and demonstrate electroplating of Cu on graphene seed layer.Graphene will be not only as the seed layer but also be the diffusion b...
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