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[期刊论文] 作者：ZHANG Yinxia,KANG Renke,GUO Do,
来源：稀有金属（英文版） 年份：2004
The depth and nature of the subsurface damage in a silicon wafer will limit the performance of IC components.Damage microstructures of the silicon wafers ground...
Effect of mechanical anisotropy on material removal rate and surface quality during polishing CdZnTe
[期刊论文] 作者：LI Yan,JIE Wanqi,KANG Renke,GA,
来源：稀有金属（英文版） 年份：2004
The mechanical characters of CdZnTe crystal were investigated by nanoscratch tests,and the effects of mechanical anisotropy on the material removal rate and sur...
[期刊论文] 作者：LI Yan,KANG Renke,GAO Hang,WU,
来源：稀有金属（英文版） 年份：2004
CdZnTe wafers were machined by lapping and mechanical polishing processes, and their surface and subsurface damages were investigated.The surface damages are ma...
[期刊论文] 作者：Guo Dongming,HAO Ping,Kang Renke,Jia Zhenyuan,
来源：机械工程学报（英文版） 年份：2004
Representation of roughness is introduced and the rationality of applying the physics-based model in RE is analyzed at first. Then the scattering theory of elec...
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