S-param相关论文
Design, analysis and test of high-frequency interconnections in 2.5D package with silicon interposer
该文从挂篮荷载计算、施工流程、支座及临时固结施工、挂篮安装及试验、合拢段施工、模板制作安装、钢筋安装、混凝土的浇筑及养生......
用S参数法测复介电常数,由于其测量手续烦、数据处理十分费事,过去人们都不愿采用。本文叙述了用自动测量线的方法,引入了计算机辅......
An optimum design of a low noise amplifier (LNA) in S-band working at 2-4 GHz is described. Choosing FHC40LG high electr......