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为了加速我国电子行业无铅化进程,利用自行设计的超音速雾化制粉试验装置,研究了过热度对Sn3Ag2.8Cu合金无铅焊锡雾化粉体颗粒形貌的影响。结果表明:通过调整合金的过热度,能够控制雾化粉体中卫星颗粒及异形颗粒的比例;当合金过热度为150℃时,雾化粉体中卫星颗粒和异形颗粒最少,颗粒球形度最好;当合金过热度为100℃时,雾化粉体颗粒球形度较差;当合金过热度为250℃时,雾化粉体卫星颗粒和片状颗粒较多。
In order to speed up the lead-free process of China’s electronics industry, the influence of superheat on the particle morphology of Sn3Ag2.8Cu alloy lead-free solder atomized powder was studied by using a self-designed supersonic atomization milling test device. The results show that the proportion of satellite particles and irregular particles in the atomized powder can be controlled by adjusting the degree of superheat of the alloy. When the superheat degree of the alloy is 150 ℃, the atomized particles and the irregular particles are the least, Good atomization powder particle sphericity is worse when the degree of superheat of the alloy is 100 ℃. When the alloy superheat degree is 250 ℃, there are more atomized powder satellite particles and flaky particles.