混合式镶嵌红外/CCD焦平面结构的探测器元件具有高的封装密度,这可用成本相宜的平面加工技术来实现。该焦平面结构更可取的是:在含有集成CCD信号处理电路的硅衬底上,有一层绝缘层,而镶嵌光伏(Hg,Cd)Te探测器阵列就制造在此绝缘层上。自探测器阵列来的光电信号,通过薄膜电互连以及穿过绝缘层并在该层表面露出的接触衬垫,与CCD电路耦合。 The hybrid mosaic IR / CCD focal plane detector element has a high packing density, which can be achieved with cost effective planar processing techniques. Preferably, the focal plane structure has an insulating layer on a silicon substrate containing an integrated CCD signal processing circuit, and an inlay photovoltaic (Hg, Cd) Te detector array is fabricated on the insulating layer. The optoelectronic signals from the detector array are coupled to the CCD circuit through thin-film electrical interconnects and contact pads exposed through the insulating layer and exposed on the surface of the layer.