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为了实现在较低超净环境下的硅／硅直接键合,提出了在乙醇的环境中进行硅／硅键合的方法,并建立了合理的物理模型,在常温、常压和低于10万级超净环境下,用普通的国产硅片进行了无水乙醇环境下的硅／硅直接键合实验.键合后进行了拉力强度测试和SEM观测,发现界面没有孔洞,说明键合质量达到了要求.拉力测试结果表明,其键合强度达到了10MPa,初步验证了该方法的可行性.
In order to achieve silicon / silicon direct bonding in a lower clean environment, a silicon / silicon bonding method in ethanol environment has been proposed and a reasonable physical model has been established. Under normal temperature, normal pressure and less than 10 10,000 ultra-clean environment, using ordinary domestic silicon wafer under the environment of anhydrous ethanol, silicon / silicon direct bonding experiments were conducted after the tensile strength test and SEM observations and found no holes in the interface, indicating the bonding quality Reached the requirement.The tensile test results show that the bonding strength of 10MPa, preliminary verified the feasibility of the method.