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多层布线技术既是个老问题同时也是个新问题。从布线设计的自由度等方面来看,以往对多层布线的重要作用就有所认识,并且作了很多的研究工作。不过,以往在这方面的研究工作是以牺牲设计的自由度来避开布线多层化,因此,实际上则认为没有必要采用把制造工艺拉得太长的多层布线技术。然而,近年来,伴随着大规模集成电路集成度增加的同时,大规模集成电路上的布线量正在增加,要求布线多层化的新局面正在到来。
Multi-layer wiring technology is both an old problem and a new one. From the perspective of the degree of freedom of wiring design and other aspects, in the past on the important role of multi-layer wiring is recognized, and made a lot of research work. However, in the past, research efforts in this area were designed to avoid the need for multi-layer wiring at the expense of design freedom. Therefore, it is actually considered unnecessary to adopt a multi-layer wiring technique that takes the manufacturing process too long. However, in recent years, with the increase in the integration of LSIs, the amount of wiring in LSIs is increasing, and a new situation requiring multi-layer wiring is on the way.