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以钨酸钠和硝酸铜为原料,采用水热合成-共还原法制备钨铜复合粉末,再通过真空热压烧结法制备钨铜复合材料,并研究了钨铜复合粉末的结构形貌,以及经不同温度热处理后钨铜复合材料的显微形貌、物性特征。结果表明:采用水热合成-共还原法可制得粒度尺寸约为70nm且颗粒分布均匀的纳米级钨铜复合粉末。钨铜复合粉末经加压烧结及热处理后可得到W相和Cu相紧密结合、Cu相均匀分布在W相周围的钨铜复合材料,其在热处理温度为950℃时致密度最高,达到99.2%;在热处理温度为800℃时导电率最高,达到46.5%IACS;在热处理温度为900℃时布氏硬度最高,达到HB285。
Tungstate and copper nitrate were used as raw materials to prepare tungsten-copper composite powder by hydrothermal synthesis-co-reduction method and tungsten-copper composite material was prepared by vacuum hot-pressing sintering method. The morphology of tungsten-copper composite powder was also studied. The microstructure and physical properties of tungsten-copper composites after heat treatment at different temperatures. The results show that nano-scale tungsten-copper composite powder with particle size of about 70nm and uniform particle distribution can be obtained by hydrothermal synthesis-co-reduction method. Tungsten-copper composite powder can be obtained by pressure sintering and heat treatment. The tungsten-copper composite material with W phase and Cu phase tightly bonded and Cu phase uniformly distributed around W phase has the highest density at the temperature of 950 ℃ and reaches 99.2% The electrical conductivity reached 46.5% IACS when the heat treatment temperature was 800 ℃, and the Brinell hardness reached HB285 when the heat treatment temperature was 900 ℃.