论文部分内容阅读
3D 互连要求制作硅直通孔的刻蚀设备具有很好的均匀性,同时要求晶圆间具有可重复性和高的生产率。
3D interconnects require that etchthroughs to make through-silicon vias have good uniformity, while requiring repeatability and high throughput between wafers.