玻璃纤维由于它的介电常数高和损耗大,通常只作为普通印制电路基板的增强材料。本文介绍了可用于微波电路基板的低介性能(εr2.35,Dk0.00007)的新型增强纤维—环烯烃共聚物纤维及其应用。通过将环烯烃共聚物纤维与玻璃纤维结合在独特的混合布中制成εr3.08,Dk0.013印制电路板基板;将混合布中环烯烃共聚物纤维熔化构成树脂的一种成分,制成εr3.25,Dk0.0013印制电路板基材;通过将含环烯烃共聚物纤维的混织布涂上独特的低介电树脂制成εr2.8,Dk0.0009印制电路板基材的试验,表明环烯烃共聚物纤维是适应当今电子技术发展要求,制作优异介电性能印制电路基板的新型增强材料,用环烯烃共聚物纤维可制出比目前最好的低介电基材质量更轻、介电性能、机械性能更有竞争力的基材。 Due to its high dielectric constant and high loss, glass fiber is generally used as a reinforcement for common printed circuit boards. This paper presents a new type of reinforced fiber-cycloolefin copolymer fiber with low dielectric constant (εr2.35, Dk0.00007) for microwave circuit substrate and its application. By the cycloolefin copolymer fibers and glass fibers combined in a unique mixed fabric made of εr3.08, Dk0.013 printed circuit board substrate; the mixed fabric in which the cycloolefin copolymer fiber is melted to form a resin component, made of εr3.25, Dk0.0013 printed circuit board substrate; by mixing the mixed fabric containing cycloolefin copolymer fiber unique low dielectric resin made εr2.8, Dk0.0009 printed circuit board substrate Tests showed that the cycloolefin copolymer fiber is a new type of reinforcing material that is suitable for the development of electronic technology and produces excellent dielectric properties of printed circuit boards. The cycloolefin copolymer fiber can produce the best low dielectric substrate quality Lighter, dielectric properties, more competitive mechanical properties of the substrate.