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本文针对覆铜箔板在应用过程中极易出现但在覆铜箔板检验中不易发现的质量问题进行了分析,指出造成的可能因素及解决方法与措施。
This paper analyzes the quality problems that the copper clad laminates are easy to find in the process of application but not easy to find in the test of the clad laminates, and points out the possible factors and the solutions and measures.