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化合物半导体微电子技术工程研究中心的长远目光集中在新一代高速通信和数据处理技术上,后者将开发光学互连的连通性、带宽以及对电磁干扰的免疫力。要想实现这一目标,必须设计和制造高性能的电学和光学器件,并且把它们安装在单片光电集成电路上(OEIC)。化合物半导体微电子技术工程研究中心(CCSM)的研究计划主要是发展制造光电集成电路的技术科学和工艺基础,并且开发这种电路在光学互连系统中的应用;教育培养这方面的工程师;把这种技术有效地转移到工业上去。研究中心在集成技术上遇到了一些障碍,我们在研究材料、处理技术、器件、子系统的设计和测试时将对这些障碍加以说明。解决这些问题的潜在方法决定着光电集成电路芯片的特性,这种芯片的制造将使被推荐的集成技术受到测试。在一个研究计划中,芯片级的光电集成电路子系统已得到构思、设计、模拟、制造和测试。该计划分成四个进程:系统的设计和分析;发射器/波导管/调制器;光电集成接收器;支撑技术。研究中心的光学互连试验台计划提出了一些更高集成水平的系统问题,并且促进了这些研究进程中各学科之间的相互作用。
The long-term vision of the Compound Semiconductor Microelectronics Engineering Research Center is focused on a new generation of high-speed communications and data processing technologies that will develop the connectivity, bandwidth, and immunity to electromagnetic interference of optical interconnects. To do this, high-performance electrical and optics must be designed and fabricated and mounted on monolithic optoelectronic integrated circuits (OEICs). The Research Program of the Compound Semiconductor Microelectronics Engineering Research Center (CCSM) focuses on the development of the technical and technological foundations for the fabrication of optoelectronic integrated circuits and the development of the application of such circuits in optical interconnection systems; the education and training of engineers in this field; This technology is effectively transferred to industry. The research center has encountered a number of barriers in the integration technology that we describe in the design and testing of materials, processing techniques, devices, subsystems. Potential solutions to these problems determine the characteristics of optoelectronic integrated circuit chips that will be manufactured with the recommended integrated technologies tested. In a research project, the chip-level optoelectronic integrated circuit subsystem has been conceived, designed, simulated, manufactured and tested. The program is divided into four processes: system design and analysis; transmitter / waveguide / modulator; optoelectronic integrated receiver; support technology. The Center’s Optical Interconnection Test Bed program presents some of the more highly integrated system issues and promotes the interplay of disciplines in these research processes.