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将紫铜板和不同尺寸的均温板作为均温组件,布置在LED模拟热源与肋片之间,研究它们在不同热流密度下的均温及热阻表现。实验结果表明,紫铜板和均温板都可使肋片底面温差显著下降,但均温板具有更短的启动时间。只有当热流密度超过一定值时,均温板的均温性能才会明显优于紫铜板,同时均温板尺寸对其均温性能有很大的影响。随着热流密度的增大,紫铜板热阻几乎不变,均温板热阻逐渐减小并趋于平缓;大尺寸均温板在获得小温差的同时,热阻也最小。
The copper plates and different size of the temperature plate as the average temperature components, arranged in the LED simulation between the heat source and the fins to study them at different heat flux density and thermal resistance under the performance. The experimental results show that both the copper plate and the soaking plate can significantly reduce the temperature difference between the bottom of the fins, but the soaking plate has a shorter starting time. Only when the heat flux density exceeds a certain value, the average temperature performance of the soaking plate will be obviously superior to that of the copper plate, meanwhile the size of the soaking plate has a great influence on the soaking performance. With the increase of heat flux density, the thermal resistance of copper plate is almost unchanged, and the thermal resistance of the platens gradually decreases and tends to be gentle; while the large size isothermal plate obtains the small temperature difference, the thermal resistance is also the smallest.