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据“日本金属学会志”Vol.49,№3(1985)报道,新日铁第三技术研究所的田口悟近来研究了板厚和张力对取向硅钢磁性的影响。一般认为,减薄板厚是减少铁损最有效的手段。但是板厚减薄之后,又会增大表面性状的影响,妨碍减少铁损。再加上还不清楚由畴壁移动引起的异常涡流损失在板厚减薄之后会表现出怎样的行为,在取向硅钢表面生成的玻璃质保护膜以及在它上面涂复的张力涂层会带给硅钢原板以张力,并使铁损减少。在板薄时,张力效果与板厚的关系也尚未弄清,为了弄清这些问题,田口悟采用了如下方法。
According to “Journal of Japan Society of Metals” Vol.49, № 3 (1985) reported, Nippon Steel Research Institute of Taguchi recently studied the thickness and tension on the orientation of silicon steel. It is generally believed that reducing sheet thickness is the most effective means of reducing iron loss. However, the thickness of the thinning, will increase the impact of surface properties, hinder the reduction of iron loss. In addition, it is unclear what anomalous eddy current loss caused by domain wall movement will exhibit after the thinning of the plate thickness. The vitreous protective film formed on the surface of the oriented silicon steel and the tension coating band coated on it To the original silicon steel tension, and to reduce iron loss. In the thin plate, the tension effect and the relationship between the thickness has not yet been clarified, in order to clarify these issues, Taguchi Wu used the following method.