照相术和化学镀层法都具有许多共同的物理和化学过程,两者仅在某些是相方面有所差异。这两种工艺的总的程序细节同的,而且都很简单。首先在需要大量沉积之处沉积少量金属,接着将补加的金属离子直接还原在先前的金属沉积层上。第二道工序需要溶解的金属离子,因为只有这种金属离子才能通过浓度梯度扩散到需要更多金属的地方。当差别明显时,其表面差别会大于实际程度。 Both photolithography and electroless plating have many common physical and chemical processes, both of which differ only in some aspects. The overall procedural details of both processes are the same, and both are simple. A small amount of metal is first deposited where a large amount of deposition is required, followed by direct reduction of the additional metal ions onto the previous metal deposit. The second process requires dissolved metal ions because only this metal ion can diffuse through the concentration gradient to where more metal is needed. When the difference is obvious, the surface difference will be greater than the actual extent.