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通过自组装层法在SiO2基底上化学镀了Ni-Mo-P薄膜,薄膜的厚度和成分通过X射线荧光仪(XRF)测定。利用新型在线应力测试方法(相干梯度敏感法CGS)对退火过程中的应力进行了全场在线测试。结果表明,定量计算得到特定成分的生长应力为3.85 GPa;在600℃、700℃退火过程中,薄膜的应力首先出现轻微缓解,之后由于热应力作用,基底与薄膜边缘处易出现应力集中,应力值高达10.1 GPa,是薄膜断裂的高危区域;薄膜的平均残余应力经热处理后得到部分缓解。
The Ni-Mo-P film was electrolessly plated on the SiO2 substrate by a self-assembled layer method. The thickness and composition of the film were measured by X-ray fluorescence (XRF). A new online stress test method (Coherent Gradient Sensing Method CGS) was used to conduct a full-field on-line test of stress during annealing. The results show that the growth stress of the specific composition is 3.85 GPa. At 600 ℃ and 700 ℃, the stress of the thin film is slightly relieved first, and then the stress concentration and stress on the edge of the substrate and the thin film tend to occur due to the thermal stress. The value of up to 10.1 GPa, is a high-risk area of the film rupture; the average residual stress of the film is partially relieved after heat treatment.