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研究了三维集成电路(3D IC)中硅通孔(TSV)的建模方法及三维集成电路电源分配网络(PDN)的建模方法,并结合PCB的电源分布网络和芯片PDN模型首次提出了一种对板级3D IC,进行电源网络上电磁敏感性的建模和协同分析方法。给出了地-信号(GS)结构和地-信号1-信号2-地(GSSG)结构TSV的电路模型,电路模型与数值仿真结果做了对比,验证了TSV电路建模方法的准确性。接着对PCB板级三维集成电路中PCB的电源分布网络,PCB过孔,集成电路封装参数进行建模。最后创建了一个PCB-三维集成电路电磁敏感性级联分析模型,使用该模型来研究3D IC对电源干扰的敏感特性,并由此指导三维集成电路的敏感性分析。
The modeling method of silicon vias (TSVs) in 3D integrated circuits (ICs) and the modeling method of 3D integrated circuit power distribution networks (PDNs) are studied. Based on PCB power distribution network and chip PDN model, Kind of board-level 3D IC, the power network electromagnetic susceptibility modeling and collaborative analysis. The circuit model of the ground-signal (GS) structure and the ground-signal 1-signal 2-ground (GSSG) structure TSV is given. The circuit model and the numerical simulation result are compared to verify the accuracy of the TSV circuit modeling method. Then, PCB PCB power distribution network, PCB vias and integrated circuit package parameters are modeled in the PCB board-level 3D integrated circuit. Finally, a PCB-3-D electromagnetic susceptibility cascade analysis model was built, which was used to study the sensitivity of 3D IC to power interference and guide the sensitivity analysis of 3D integrated circuits.