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本文介绍了锡焊技术简要发展史,对目前国内外锡-铅焊料抗氧化的主要方法进行了简评,并着重叙述了采用精细冶金和添加微量元素法的K-O型抗氧化锡-铅焊料的研制。K-O型抗氧化锡-铅焊料经检测试用表明,比同类型普通锡-铅焊料具有明显的抗氧化效果,液面光亮,渣量少;抗氧化温度达320℃;可焊性好,焊点光亮,搪锡薄而均匀;操作简便,工艺稳定可靠;可节约焊料50％以上,具有明显的经济效益,是电子工业一种较理想的互连材料。
This paper introduces a brief history of the development of soldering technology, briefly reviews the current domestic and international methods for the oxidation resistance of tin-lead solder, and focuses on the use of fine metallurgy and trace element method KO-type tin oxide-lead solder Development. KO-type anti-tin oxide tin-lead solder test showed that the test shows that compared with the same type of ordinary tin-lead solder has a significant antioxidant effect, bright liquid, less slag; oxidation temperature of 320 ℃; good solderability, solder joints Bright, thin tin lining and uniform; easy to operate, the process is stable and reliable; can save more than 50% of the solder, with significant economic benefits, the electronics industry is an ideal interconnect material.