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用化学镀和粉末冶金的方法制备出W-15Cu复合材料。首先用化学方法对W粉表面预处理,然后在其表面化学镀铜。得到的复合粉末用图谱进行表征。发现用化学镀的方法制备出的W-15Cu复合粉末纯度非常高,且W颗粒均匀、被Cu致密的包覆着。呈现出包状结构。这种复合粉末表现出优异的压制性能,压坯分别在300,400,500,600 MPa的压制压力下成形。压坯在1250℃温度下保温90min烧结后,从其断口形貌可以发现W颗粒没有明显的长大,且W颗粒表面特征并没有发生改变,仍然表现出预处理后的表面特征。对烧结体的相对密度、硬度、抗弯强度和电导率同样进行了表征。
W-15Cu composites were prepared by electroless plating and powder metallurgy. The first chemical method of W powder surface pretreatment, and then its surface electroless copper plating. The obtained composite powder was characterized by using a map. It is found that the W-15Cu composite powder prepared by electroless plating has a very high purity and the W particles are uniform and densely coated by Cu. Showing a bag-like structure. This composite powder shows excellent pressing properties, and the green compact is formed at a pressing pressure of 300, 400, 500 and 600 MPa, respectively. After the compact was sintered at 1250 ℃ for 90 minutes, the W particles did not grow obviously and the surface features of W particles did not change. The surface features of the particles still showed pretreatment. The relative density, hardness, flexural strength and electrical conductivity of the sintered body were likewise characterized.