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利用摄动分析结合打靶法，分析了具有单侧表面约束的圆板，在面内压力与横向力联合作用下发生屈曲和过屈曲问题，得到了在一系列横向力作用下周边固支和简支圆板的过屈曲路径。在微电子元件和微力电系统中大量存在有薄膜－基底结构，此结构中也存在屈曲和过屈曲问题。承受残余压应力作用的薄膜由于屈曲、驱动界面的脱层破坏，同时由于脱层内部处于真空状态，薄膜外的大气压起到了横向力的作用；而基底的刚性则提供了脱层薄膜的横向变形约束。所得结果可用于这类薄膜一基底结构中承压薄膜的屈曲驱动层裂扩展的分析。
Using the perturbation analysis combined with the shooting method, the circular plate with one-sided surface constraint is analyzed. The buckling and over-buckling problems under combined action of in-plane pressure and lateral force are analyzed. Branch of the flexion path. There is a large number of thin film-substrate structures in microelectronic components and micro-electromechanical systems, and there are also problems of buckling and over-flexion in this structure. The film subjected to residual compressive stress delaminates due to buckling and driving interface, and at the same time, the atmospheric pressure outside the film acts as a lateral force due to the vacuum inside the delamination; and the rigidity of the substrate provides lateral deformation of the delaminated film constraint. The results obtained can be used to analyze the buckling-driven crack propagation in pressure-bearing films in such film-substrate structures.