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为了研究凸点材料对器件疲劳特性的影响,采用非线性有限元分析方法、统一型黏塑性本构方程和Coffin-Manson修正方程,对Sn3.0Ag0.5Cu,Sn63Pb37和Pb90Sn10三种凸点材料倒装焊器件的热疲劳特性进行了系统研究,对三种凸点的疲劳寿命进行了预测,并对Sn3.0Ag0.5Cu和Pb90Sn10两种凸点材料倒装焊器件进行了温度循环试验。结果表明,仿真结果与试验结果基本吻合。在热循环过程中,凸点阵列中距离器件中心最远的焊点,应力和应变变化最剧烈,需重点关注这些危险焊点的可靠性;含铅凸点的热疲劳特性较无铅凸点更好,更适合应用于高可靠的场合;而且随着铅含量的增加,凸点的热疲劳特性越好,疲劳寿命越长。
In order to study the influence of the bump material on the fatigue properties of the device, three kinds of bump materials, Sn3.0Ag0.5Cu, Sn63Pb37 and Pb90Sn10, were poured by nonlinear finite element method, unified visco-plastic constitutive equation and Coffin-Manson correction equation. The thermal fatigue characteristics of the welding equipment were systematically studied. The fatigue life of the three kinds of bumps was predicted. Temperature cycling tests were conducted on flip-chip devices of Sn3.0Ag0.5Cu and Pb90Sn10. The results show that the simulation results are in good agreement with the experimental results. During the thermal cycling, the solder joints with the farthest distance from the center of the device in the bump array have the most dramatic changes in stress and strain. The reliability of these hazardous solder joints needs to be focused on. The thermal fatigue characteristics of lead bumps are better than those of lead-free bumps Better, more suitable for high reliability applications; and with the increase of lead content, the thermal fatigue properties of the bump better, the longer the fatigue life.