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薄膜传热性能对微电子设备的传热能力及其性能和可靠性有重大影响 ,测量薄膜的热物性参数并进一步研究其影响因素 ,可为微电子电路的设计和发展提供科学依据。评述了薄膜导热系数测量和研究的现状 ,在此基础上提出了一种新的能同时测量衬底薄膜导热系数和发射率的实验方案 ,并通过建立衬底薄膜试样传热的数学模型和分析推导 ,论证了该实验方案的可行性。本实验方案可推广应用于确定淀积在衬底薄膜上各种极小厚度薄膜的导热系数和发射率
The heat transfer performance of the film has a significant impact on the heat transfer capability of the microelectronic device and its performance and reliability. Measuring the thermophysical properties of the film and further research on its influencing factors can provide a scientific basis for the design and development of microelectronic circuits. The current situation of the measurement and research on the thermal conductivity of the thin film is reviewed. Based on this, a new experimental scheme of measuring the thermal conductivity and the emissivity of the thin film is proposed. By establishing the mathematical model of the heat transfer of the thin film, Analysis and deduction, demonstrate the feasibility of the experimental program. The experimental scheme can be extended to determine the thermal conductivity and emissivity of thin films deposited on the substrate film