论文部分内容阅读
近年来,人们认识到远红外线加热器是加热最有效的一种方法,它已应用到所有的产业部门,取得了大量的实际效果。在厚膜印制基板的烧结方面,也正在由需要60分钟烧结的马弗式传送带炉,向采用红外线直接加热、烧结时间只需20分钟的高速烧结方向过渡。 本公司采用红外线加热器的远红外线加热技术和新研制成的高温石英加热器,开发出了厚膜IC红外线烧结炉,并巳投入实际使用。 本文介绍NGK红外线烧结炉的梗概,高温石英加热器的特征以及厚膜浆料的高速烧结结果。
In recent years, it has been recognized that far-infrared heaters are one of the most effective heating methods and have been applied to all industrial sectors with a great deal of practical results. In thick film printed circuit board sintering, is also required 60 minutes sintering muffle conveyor furnace, direct heating with infrared, sintering time is only 20 minutes high-speed sintering direction transition. The company uses infrared heater far-infrared heating technology and the newly developed high-temperature quartz heater, developed a thick film IC infrared sintering furnace, and has been put into practical use. This article describes the outline of the NGK Infrared Sintering Furnace, features of the high temperature quartz heater, and high-speed sintering of thick film pastes.