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利用 DSC 热扫描仪、X 射线衍射仪、透射电镜和显微硬度计等,研究了化学镀3.0%P、5.0%P、7.0%P 和10.0%P 合金的组织转变及硬化过程。低磷合金(P<7.05)系晶态过饱和固溶体,高磷合金为非晶态;在加热过程中,过饱和固溶体脱溶分解,析出第二相Ni_3P。非晶态镍磷合金发生晶化反应,然后生成 Ni_3P。镍磷合金镀层的显微硬度随热处理温度升高而增加,至400℃获得最大硬度值,而后又下降。低磷合金是典型的沉淀硬化机制,高磷合金表现为分散强化。
The microstructure evolution and hardening process of 3.0% P, 5.0% P, 7.0% P and 10.0% P electroless plating were studied by DSC thermal scanning, XRD, TEM and microhardness tester. The low-phosphorus alloy (P <7.05) is a supersaturated supersaturated solid solution and the high-phosphorus alloy is amorphous. During the heating process, the supersaturated solid solution dissolves and decomposes to precipitate the second phase Ni_3P. Amorphous Ni-P alloy crystallization reaction, and then generate Ni_3P. The microhardness of Ni-P alloy coatings increases with the increase of heat treatment temperature, reaches the maximum hardness value at 400 ℃, and then decreases again. Low phosphorus alloy is a typical precipitation hardening mechanism, high phosphorus alloy showed dispersion strengthening.