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3 2012年ITRS新内容——技术工作组总结3.1系统驱动与设计表3为主要产品市场以及对系统驱动的影响。表4为总体设计技术的挑战。3.2测试及测试设备2012年路线图测试列表中没有重大改动,但增加了一些参数,并对表格进行了一些调整:●DRAM性能的非晶圆并行测试已及时调整为全晶圆测试。450 mm晶圆生产预计于2017年开始。DRAM的速度性能测试已被加入到2012年探针卡列表;但2012年并行性能测试被限制在32个芯片,并将及时提高到64个芯片并行性能测试。
3 New 2012 ITRS - Technical Work Team Summary 3.1 System Drivers and Design Table 3 shows the main product markets and their impact on system drivers. Table 4 challenges the overall design technique. 3.2 Test and Test Equipment There are no major changes in the 2012 roadmap test list, but some parameters have been added and some changes have been made to the table: ● Non-parallel testing of DRAM performance has been timely adjusted to full wafer testing. 450 mm wafer production is expected to begin in 2017. The DRAM speed performance test has been added to the 2012 probe card list; however, parallel performance testing in 2012 was limited to 32 chips and will be timely tested in 64 chip parallel performance tests.