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半导体片状器件制造的最后工艺是划片。这道工艺虽然仅仅是分割片子,但却是极其重要的。(1)合格芯片有变成次品的可能。(2)为了将片子分割开就要进行划线,这样就会减少片子表面积。(3)由于机械原因造成芯片损伤。
The final manufacturing process for semiconductor chip devices is scribing. Although this process is only divided film, but it is extremely important. (1) Qualified chips may become defective. (2) In order to split the film will be crossed, which will reduce the film surface area. (3) chip damage due to mechanical reasons.