Zarlink半导体公司日前宣布推出世界上容量最大的阻塞式和非阻塞式TDM(时分复用)交换芯片。这些芯片提供了业界最灵活的4种模式TDM架构,允许设计人员在支持多种业务的广域网(WAN)接入设备中以极高的成本效率处理成千上万的话音、数据信道。服务供应商不断推出新的话音、数据和视频服务,从而推动了对具有大带宽和更高灵活性的多种业务网络设备的需求。Zarlink公司的新芯片针对大带宽TDM交换设备应用而优化,可广泛应用于包括中心局交换机、数字环路载波系 Zarlink Semiconductor has announced the world's largest blocking and non-blocking TDM (Time Division Multiplex) switching chips. These chips provide the industry's most flexible four-mode TDM architecture, allowing designers to cost-effectively handle thousands of voice and data channels in a wide area network (WAN) access device supporting multiple services. Service providers continue to introduce new voice, data and video services, driving the need for multiple business networking devices with large bandwidth and greater flexibility. Zarlink's new chips are optimized for use in high-bandwidth TDM switching equipment and are widely used in applications including central office switches, digital loop carrier