论文部分内容阅读
采用自制蠕变装置,研究了Sn-0.7Cu-1Ag无铅钎料在温度为60～120℃,压力为30～50 MPa下的压入蠕变行为,并利用SEM和XRD对钎料蠕变前后组织的变化进行了分析。结果表明:随温度和应力的增加,钎料的蠕变速率增大;Ag在金属间化合物形成前期可以促进形核,后期可以阻碍晶粒的长大,起到细化晶粒的作用,从而增加了相界面,增加了滑移变形的阻力;Ag3Sn、Cu6Sn5两相呈弥散分布,对基体的变形起到阻碍作用。Ag的加入起到了细晶强化和弥散强化作用,极大地提高了钎料的抗蠕变性能。
The creep behavior of Sn-0.7Cu-1Ag lead-free solder at 60 ~ 120 ℃ and 30 ~ 50 MPa was investigated by self-made creep test. The creep behavior of the solder was studied by SEM and XRD. Changes in the organization before and after the analysis. The results show that the creep rate of solder increases with the increase of temperature and stress. Ag can promote nucleation in the early stage of formation of intermetallic compounds and later can hinder the growth of grains and refine the grains. Increase the phase interface, increase the sliding deformation resistance; Ag3Sn, Cu6Sn5 two-phase was dispersed, the deformation of the substrate hinder the role. The addition of Ag plays a role of fine grain strengthening and dispersion strengthening, which greatly improves the creep resistance of the solder.