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对集成电路（ＩＣ）芯片特定部位作透射电镜（ＴＥＭ）分析，样品制备是非常关键的一步。为此，许多实验室￣［１－３］发展了各种针对性的制样技术。通过吸取各种制样技术的长处，结合目前一般ＴＥＭ实验室的制样条件，本文介绍一种用于普通ＴＥＭ实验室的ＩＣ芯片具体制样方法──使用玻璃陪片，在光学显微镜监视下，以机械减薄形成“劈”形试样，使被分析目标在“劈”的“刃口”上。最后用低角度离子磨削使被分析目标附近形成理想的电子透明薄区。
Specimen preparation is a key step for TEM analysis of specific locations on integrated circuit (IC) chips. To this end, many laboratories [1-3] developed a variety of targeted sample preparation techniques. By drawing on the advantages of various sample preparation techniques and combining with the current general TEM laboratory sample preparation conditions, this paper introduces a specific sample preparation method for IC chips used in ordinary TEM laboratories ─ ─ using glass-coated, under the optical microscope , To form a mechanical thinning “split” shape of the sample, the analysis of the target in the “split” the “cutting edge.” Finally, low-angle ion milling is used to make the ideal electron-transparent thin region near the target to be analyzed.