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近年来,固体器件虽然取得了惊人的进展,但作为在玻璃、陶瓷基板上形成电极的方法,一般仍是采用贵金属膏料粘结法,真空蒸发法,化学淀积法及机械压焊法等。上述方法虽然都比较简便,却都存在不少问题。尤其如何保证气密性,从一开始就是一个技术上的难题,到目前为止仍在努力寻找简便而又高可靠的密封方法。 最近日本旭硝子研究所公布了一种名叫“蜡凝胶”的新焊料。这种蜡凝胶通过超声波钎焊烙铁,不需任何前处理就可将引线或片子焊接到玻璃、陶瓷、器件表面及其它密封材料上。这种蜡凝胶仍以Pb—Sn合金为主要成分、再加微量的Zn、Sb、Ae、Ti、Si等构成的低融点合金。焊接时不是象普通焊料那样,借助于助溶剂对金属表面的浸湿性,而是利用超声波振动的气蚀效应,在使焊接面迅速脱泡的同时,促进液相—固相界面的反应来进行焊接的。此种方法的焊接强度和气密性,完全可以满足一般电子部件的要求。
Although solid state devices have made remarkable progress in recent years, as a method for forming electrodes on glass and ceramic substrates, there are generally used methods such as a noble metal paste bonding method, a vacuum evaporation method, a chemical deposition method and a mechanical bonding method . Although the above methods are relatively simple, they all have many problems. In particular, how to ensure air-tightness has been a technical challenge from the very beginning, and so far it is still hard to find a simple and highly reliable method of sealing. Asahi Glass Research Institute recently announced a new type of wax called “wax gel.” This wax gel is soldered to the glass, ceramic, device surface, and other sealing materials by ultrasonic soldering iron without any pretreatment. This wax gel is still Pb-Sn alloy as the main component, plus a trace amount of Zn, Sb, Ae, Ti, Si and other low melting point alloy. Soldering is not carried out by the solderability of the metal surface but by the cavitation effect of ultrasonic vibration, unlike the ordinary soldering, which promotes the degassing of the weld surface and promotes the reaction at the liquid-solid interface Welding. This method of welding strength and air tightness, fully meet the requirements of the general electronic components.