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已经生产了7个ALADDIN(InSb的高级大面积探测器发展计划)传感器芯片组件,现在还在生产另外9个传感器组件。在本文中,我们介绍了ALADDIN传感器芯片组件的设计、细节以及实测性能。ALADDIN传感器芯片组件的面积超过7.5cm~2,这是当今正在使用的最大的单片红外列阵。它是一种通过铟丘使InSb探测器与硅读出电路相连的混成式组件。这种大小的列阵能够制成,是因为InSb探测器材料已被减薄到10μm以下,这使得它能够适应InSb/硅的热失配。ALADDIN发展计划是成功的,它所产生的器件符合原先的大部分设计目标。ALADDIN I的经验使读出多路传输器设计得到了改进。我们预计,通过这些变化,ALADDIN传感器芯片组件将可以实现其余的一些目标。新的读出电路的加工已经完成,但测试工作还刚刚开始。ALADDIN计划是国家光学天文观察站(NOAO)、美国海军观测站(USNO)以及圣巴巴拉研究中心(SBRC)三者之间的一项共同合作计划。
Seven ALADDIN (InSb Advanced Large Area Probe Development Program) sensor chip assemblies have been produced and an additional nine sensor assemblies are still being manufactured. In this article, we introduced the design, details, and measured performance of the ALADDIN sensor chip assembly. ALADDIN sensor chip assembly area of more than 7.5cm ~ 2, which is currently using the largest single-chip infrared array. It is a hybrid unit that connects an InSb detector to a silicon readout via indium mound. This size array can be fabricated because the InSb detector material has been thinned to less than 10μm, making it suitable for InSb / silicon thermal mismatch. The ALADDIN development program was successful and produced devices that met most of the original design goals. The ALADDIN I experience has improved the read-out multiplexer design. We anticipate that with these changes, ALADDIN sensor chipsets will achieve some of the remaining goals. The processing of the new readout circuit has been completed, but testing has just begun. The ALADDIN program is a joint project of cooperation between the National Optical Astronomical Observatory (NOAO), the US Navy Observatory (USNO) and the Santa Barbara Research Center (SBRC).