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1.导论由于热电摄像管的发展,产生了一系列廉价又可在室温下工作的热像仪。近来,注意力又转到了大规模(包含几百至几千个探测器)热电列阵的固态读出上,特别是二维列阵与硅CCD的互连问题上。其目的是改进尺寸、功率要求和坚固性等物理特性及提高对景物温度的识别能力。本文给出电互连与热互连的理论分析;确定关键的设计参数(器件参数与几何尺寸的关系);对一适当的设计研究其信号和噪声性能;预示噪声等效温差(NEFD)在0.5℃左右;并在特制的CCD上进行了实验检定。热电-硅CCD混合式器件的设计很大程度上取决于热电和CCD之间的互连考虑。简
1. Introduction Due to the development of thermopile tubes, a series of thermal imagers have been produced that are inexpensive and workable at room temperature. Recently, attention has also been given to the solid-state readout of a large-scale thermoelectric array (including several hundreds to several thousands of detectors), in particular, the problem of interconnection of a two-dimensional array with a silicon CCD. Its purpose is to improve physical properties such as size, power requirements and ruggedness and to improve the ability to recognize scene temperatures. In this paper, the theoretical analysis of electrical interconnect and thermal interconnection is given. The key design parameters (the relationship between device parameters and geometrical dimensions) are determined. The signal and noise performance of an appropriate design is studied. The predicted noise equivalent temperature difference (NEFD) 0.5 ℃ or so; and in a special CCD on the experimental test. The design of a hybrid thermoelectric-silicon CCD device depends very much on the interconnection between the thermoelectric and the CCD. simple