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本篇围绕着铜箔涨价及“铜箔-覆铜板-印制电路板”产业链出现的供需关系失衡问题,在对2016年召开的铜箔技术·市场研讨会的采访、调查的基础上,作以阐述与前景探究。
This article focuses on price increases of copper foil and imbalance between supply and demand in the “copper foil-copper clad laminate-printed circuit board” industry chain. In an interview with the copper foil technology market seminar held in 2016, Based on, to elaborate and explore the future.